Method and apparatus for manufacturing white light-emitting device

ABSTRACT

Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No.10-2011-0004530, filed on Jan. 17, 2011, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND

1. Field

The present disclosure relates to methods and apparatuses formanufacturing a white light-emitting device, and more particularly, tomethods and apparatus for manufacturing a semiconductor light-emittingdevice that emits white light by forming a phosphor layer on an emissionsurface of the semiconductor light-emitting device at a wafer-level.

2. Description of the Related Art

Light emitting diodes (LEDs) are semiconductor light-emitting devicesthat change an electric signal into light by using the characteristicsof a compound semiconductor. Semiconductor light-emitting devices suchas LEDs have a longer lifetime than other general luminous bodies, aredriven at a low voltage, and have low power consumption. Also, thesemiconductor light-emitting devices such as LEDs have excellentresponse speeds and impact resistance and are small and light in weight.Such a semiconductor light-emitting device may emit lights of differentwavelengths according to the type and composition of a semiconductorused and if desired, may form lights of different wavelengths.

Currently, lighting lamps using a white light-emitting device havinghigh brightness have been replaced with general fluorescent lamps orincandescent lamps. The white light-emitting device may be manufacturedby forming a red, green, or yellow phosphor layer on a emission surfaceof the light emitting device that emits blue or UV light. The phosphorlayer is generally formed in the light emitting device during theseparation of the light emitting device from a wafer and packaging. Forexample, the phosphor layer may be formed by coating phosphor paste onthe light emitting device and hardening the phosphor paste afterattaching the light emitting device on a wiring substrate such as a leadframe or a printed circuit board (PCB). However, when the phosphor layeris formed during packaging, optical characteristics of each completedlight-emitting device package may vary by dispersion generated whileforming the phosphor layer in each packaging process. Accordingly, itmay be hard to secure uniform quality of a light-emitting devicepackage.

SUMMARY

Provided are methods and apparatuses for manufacturing a semiconductorlight-emitting device that emits white light by forming a phosphor layeron an emission surface of the semiconductor light-emitting device at awafer-level.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to an aspect of the present invention, a method ofmanufacturing a light-emitting device includes: forming a plurality oflight emitting devices on a wafer; thinning the wafer, on which theplurality of light-emitting devices are formed; disposing the thinnedwafer on a carrier film; and forming a phosphor layer on an emissionsurface of the plurality of light-emitting devices on the wafer.

The forming of the phosphor layer may include: disposing the carrierfilm, on which the wafer is disposed, on a vacuum table; closelyadhering and fixing the carrier film on the vacuum table by vacuumsuction pressure; coating a phosphor paste on the wafer; and forming thephosphor layer by hardening the phosphor paste.

The vacuum table may have a stepped structure, in which a center portionthereof protrudes to be higher than peripheral portions thereof.

A carrier frame may be disposed along a circumference of the carrierfilm, and a diameter of the protruding center portion of the vacuumtable may be smaller than an inner diameter of the carrier frame.

The carrier frame formed along the circumference of the carrier film maybe closely adhered and fixed to the peripheral portions of the vacuumtable, and the wafer disposed on the carrier film may be closely adheredand fixed to the center portion of the vacuum table.

A height of the center portion of the vacuum table may be higher than aheight of the carrier frame.

The coating of the phosphor paste may include: disposing a printing maskon the wafer; providing the phosphor paste on the printing mask; andpressurizing the phosphor paste by using a squeeze and uniformly coatingthe phosphor paste on the wafer.

The printing mask may include a mask frame formed around thecircumference of the printing mask to support the printing mask, a firstmasking member formed to cover a region other than the wafer, and aprinting region corresponding to the wafer.

The printing region may include a plurality of openings having the samepattern as that of the plurality of light-emitting devices formed on thewafer, a second masking member formed to correspond to the scribe lineformed between the light-emitting devices, and third masking membersformed to correspond to electrode pads formed on the light-emittingdevices.

The printing region may include a plurality of openings having the samepattern as that of the plurality of light-emitting devices formed on thewafer and a second masking member formed to correspond to the scribeline formed between the light-emitting devices, the second maskingmember being extended to regions corresponding to the electrode padsformed on the light-emitting devices.

The printing region may include one opening entirely formed in theprinting region and third masking members formed to correspond toelectrode pads formed on the light-emitting devices.

The method may further include: after the phosphor layer is formed,removing the wafer from the carrier film; and dicing the plurality oflight-emitting devices formed on the wafer.

The carrier film may include a base film and a cohesive layer formed onthe base film.

The cohesive layer may include a photosensitive adhesive (PSA) that maybe hardened by UV light and the base film has permeability for UV light.

The removing of the wafer from the carrier film may include hardeningthe cohesive layer by irradiating UV light from the lower side of thecarrier film and removing the wafer from the hardened cohesive layer.

According to another aspect of the present invention, a method ofmanufacturing a light-emitting device includes: forming a plurality oflight-emitting devices on a wafer; thinning the wafer, on which theplurality of light-emitting devices are formed; separating the pluralityof light-emitting devices formed on the wafer through dicing; arrangingthe separated light-emitting devices on a carrier film; and forming aphosphor layer on an emission surface of the plurality of light-emittingdevices arranged on the carrier film.

The forming of the phosphor layer may include: disposing the carrierfilm, on which the light-emitting devices are arranged, on a vacuumtable; closely adhering and fixing the carrier film on the vacuum tableby vacuum suction pressure; coating a phosphor paste on thelight-emitting devices; and forming the phosphor layer by hardening thephosphor paste.

According to another aspect of the present invention, an apparatus formanufacturing a light-emitting device includes: a vacuum tablecomprising a center portion protruding upward and peripheral portionsthat are stepped to be lower than the center portion; a carrier filmdisposed on the vacuum table for attaching the wafer, on which aplurality of light-emitting devices are formed, on the carrier film; anda printing mask for uniformly coating a phosphor paste on the wafer.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings of which:

FIGS. 1A and 1B are cross-sectional views schematically illustrating themanufacturing of a semiconductor light-emitting device on a wafer;

FIG. 2 illustrates patterns of a plurality of semiconductorlight-emitting devices formed on a wafer;

FIGS. 3A through 3D are cross-sectional views schematically illustratingforming of a phosphor layer on an emission surface of a semiconductorlight-emitting device at a wafer-level;

FIGS. 4A and 4B respectively are a plan view and a cross-sectional viewschematically illustrating a carrier film and a wafer disposed on thecarrier film illustrated in FIGS. 3A through 3D;

FIGS. 5A and 5B are plan views schematically illustrating a structure ofa printing mask of FIGS. 3A through 3D;

FIGS. 6 through 8 illustrate various examples of a printing mask; and

FIG. 9 schematically illustrates removing of a phosphor formed on anelectrode pad of a light emitting device by irradiating laser.

DETAILED DESCRIPTION

Hereinafter, a method and apparatus for manufacturing a whitelight-emitting device according to one or more embodiment of the presentinvention will be described in detail with reference to the accompanyingdrawings. In the drawings, like reference numerals denote like portionsand sizes of each element are exaggerated for clarity.

In the method of manufacturing a white light-emitting device, accordingto the current embodiment of the present invention, a plurality ofsemiconductor light-emitting devices 110 are formed on a wafer 101, asillustrated in FIG. 1A. The wafer 101 may be formed of, for example,sapphire, GaN, or silicon. The plurality of semiconductor light-emittingdevices 110 may be formed on the wafer 10 by using a generally knownmethod. Although not illustrated in FIG. 1A, a buffer layer, an n-typenitride semiconductor layer, an active layer as a multiple quantum well,and a p-type nitride semiconductor layer are formed on the wafer 101 andthen the p-type nitride semiconductor layer is partially mesa etched soas to form a p-type electrode and an n-type electrode. Various methodsof forming the semiconductor light-emitting devices 110 on the wafer 101are well known, and the present invention is not particularly restrictedto any particular method.

FIG. 2 illustrates patterns of the plurality of semiconductorlight-emitting devices 110 formed on the wafer 101. At the left side ofFIG. 2, the patterns of the plurality of semiconductor light-emittingdevices 110 formed on the wafer 101 are illustrated. In an enlarged viewillustrated at the right side of FIG. 2, the plurality of semiconductorlight-emitting devices 110 may be generally formed and arranged on thewafer 101 in a square lattice form. An emission surface 111 for emittinglight and at least one electrode pad 112 and 113 for electric connectionmay be formed on an upper surface of each semiconductor light-emittingdevice 110. In FIG. 2, two electrode pads 112 and 113, that is, anN-type electrode pad 112 and a P-type electrode pad 113, are formed onthe upper surface of the semiconductor light-emitting device 110. Forexample, the two electrode pads 112 and 113 may be respectively disposedat corners that face each other in a diagonal direction on thesemiconductor light-emitting device 110. The semiconductorlight-emitting devices 110 are separated from other adjacentsemiconductor light-emitting devices 110 through a scribe line 114. In asubsequent dicing process for separating each semiconductorlight-emitting device 110, the wafer 101 may be cut along the scribeline 114.

When forming of the plurality of semiconductor light-emitting devices110 on the wafer 101 is completed, the wafer 101 is thinned, asillustrated in FIG. 1B. For example, the wafer 101 may be ground to havea thickness of about 10 to about 200 μm. If a phosphor layer is firstformed on the semiconductor light-emitting devices 110 and then thewafer 101 is thinned, the wafer 101 should be turned upside down so thata bottom surface of the wafer faces upward and thus the phosphor layeris attached on a substrate for grinding. However, in this case, thephosphor layer on the semiconductor light-emitting devices 110 may bedamaged during a thinning process and it is hard to attach the phosphorlayer on the substrate for grinding.

After thinning the wafer 101, the phosphor layer is formed on anemission surface of the semiconductor light-emitting devices 110 at awafer-level by using, for example, screen printing. FIGS. 3A through 3Dare cross-sectional views schematically illustrating forming of thephosphor layer on the emission surface of the semiconductorlight-emitting devices 110 at a wafer-level. In FIG. 3, for convenienceof description, the semiconductor light-emitting devices 110 formed onthe wafer 101 are not illustrated. Referring to FIG. 3A, the wafer 101is attached on a carrier film 120 and then the carrier film 120 isdisposed on a vacuum table 130. Then, a printing mask 140 is disposedabove the wafer 101.

In general, when the wafer 101 is thinned by the thinning process, thewafer 101 may be warpaged during the forming of the phosphor layer. Inorder to prevent warpage, the phosphor layer is formed while the wafer101 is attached on the carrier film 120 according to an embodiment ofthe present invention. Then, since the carrier film 120 holds the wafer101, the wafer 101 is hardly warpaged. FIGS. 4A and 4B respectively area plan view and a cross-sectional view schematically illustrating thecarrier film 120 and the wafer 101 disposed on the carrier film 120.Referring to FIG. 4A, the wafer 101 is attached at the center of thecarrier film 120 and a carrier frame 121 is installed along acircumference of the carrier film 120. As will be described later, thecarrier frame 121 tightly fixes the carrier film 120 on the vacuum table130 during the forming of a phosphor so that the carrier film 120 maynot be moved or modified. In FIG. 4A, the carrier frame 121 in aring-form is illustrated; however, the form of the carrier frame 121 isnot limited thereto. For example, the carrier frame 121 may be disposedat both edges of the carrier film 120 in the form of a straight-line baror an arc.

Referring to FIG. 4B, the carrier film 120 may include a base film 120 aand a cohesive layer 120 b formed on the base film 120 a. The base film120 a may have heat resistance so as to endure the forming process ofthe phosphor layer by heating and hardening phosphor paste. Also, thebase film 120 a may have flexibility and UV permeability. The cohesivelayer 120 b is formed to secure location stability of the wafer 101arranged on the carrier film 120. For example, the cohesive layer 120 bmay include a photosensitive adhesive (PSA) that may be hardened by UVlight. When the cohesive layer 120 b includes the PSA, UV lightpenetrates through the base film 120 a after completing forming of thephosphor layer and the cohesive layer 120 b is hardened. Then, the wafer101 may be easily separated from the cohesive layer 120 b.

FIGS. 5A and 5B are plan views schematically illustrating a structure ofthe printing mask 140 of FIGS. 3A through 3D. For example, the printingmask 140 may be a stencil mask including a masking member formed on amesh structure including steel use stainless (SUS) to partially coverthe mesh structure. Referring to FIG. 5A, the printing mask 140 mayinclude a mask frame 141 formed around the circumference of the printingmask 140 to support the printing mask 140, a first masking member 143formed to cover a region other than the wafer 101, and a printing region142, on which the first masking member 143 is not formed. The printingregion 142 may be formed to correspond to the wafer 101. That is, thesize and form of the printing region 142 may be the same as those of thewafer 101. In FIG. 5A, SUS having the mesh structure is viewed in theprinting region 142. FIG. 5B is an enlarged view of the printing region142. Referring to FIG. 5B, a plurality of openings 144 having the samepattern as that of the plurality of semiconductor light-emitting devices110 are formed in the printing region 142. Also, a second masking member145 is formed to correspond to the scribe line 114 formed between thesemiconductor light-emitting devices 110, and third masking members 146are formed to correspond to the electrode pads 112 and 113 of thesemiconductor light-emitting devices 110. The first, second, and thirdmasking members 143, 145, and 146 may be formed of, for example, polymeror a metal thin film.

Referring to FIG. 3B, a vacuum is applied to the vacuum table 130 sothat the carrier film 120 is closely adhered and fixed to the vacuumtable 130 by vacuum suction pressure. As illustrated in FIG. 3B, thevacuum table 130 may have a stepped structure in which a center portionthereof protrudes upward and thus is higher than peripheral portions.Then, the carrier frame 121 formed at the circumference of the carrierfilm 120 is closely adhered to the peripheral portions of the vacuumtable 130, and the wafer 101 disposed on the carrier film 120 may beclosely adhered and fixed to the center portion of the vacuum table 130.In this regard, a diameter of the center portion of the vacuum table 130that protrudes may be smaller than the inner diameter of the carrierframe 121. Due to the stepped structure of the vacuum table 130, theupper surface of the wafer 101 may be higher than the upper surface ofthe carrier frame 121. In this regard, a height of the center portion ofthe vacuum table 130 may be higher than a height of the carrier frame121. Then, the printing mask 140 may contact the wafer 101 withoutobstruction by the carrier frame 121. Referring back to FIG. 3B, thevacuum table 130, on which the carrier film 120 is closely adhered andfixed, rises so that the printing mask 140 contacts the wafer 101. Here,the printing region 142 in the printing mask 140 is arranged to matchwith the wafer 101.

When the printing mask 140 is dispersed on the wafer 101, a phosphorpaste 160 is provided on the printing mask 140, as illustrated in FIG.3C. Then, the phosphor paste 160 is pushed and pressurized by using asqueeze 135. While the phosphor paste 160 exits through the printingregion 142 of the printing mask 140, the phosphor paste 160 is uniformlycoated on the wafer 101. The squeeze 136 may be formed of a plasticmaterial so as to prevent metal particles from generating due tofriction with the first, second, and third masking members 143, 145, and146. For example, the squeeze 135 may be formed of an engineeringplastic having excellent abrasion resistance and mechanical propertiessuch as nylon, in addition to, urethane, acryl, and polycarbonate.

The phosphor paste 160 may be a mixture of a single type or a pluralityof types of phosphor and a binder resin mixed according to apredetermined mixture ratio. The type and mixture ratio of the usedphosphor may be selected according to desired emission characteristics.The binder resin may be formed of a material having excellent heatresistance and light transmittance and high photorefractive index. Forexample, epoxy- or silicon-based curable resin may be used. Such acurable resin may have a shore A hardness of 50 or above afterhardening. Also, the curable resin may be mainly formed of athermosetting resin material, wherein the thermosetting resin materialmay partially include UV curable material.

When the phosphor paste 160 is uniformly coated on the wafer 101, thevacuum table 130 drops downward, as illustrated in FIG. 3D, and thewafer 101 is removed from the printing mask 140. Then, the phosphorpaste 160 is heated and hardened so that a phosphor layer 150 may beformed on the wafer 101. Also, the phosphor paste 160 is firstlyhardened and the phosphor layer 150 is formed and then the vacuum table130 drops downward so that the wafer 101 may be removed from theprinting mask 140.

When forming of the phosphor layer 150 is completed, the wafer 101formed on the carrier film 120 may be separated from the carrier film120. When the cohesive layer 120 b is formed of a PSA that may behardened by UV light, UV light may be irradiated from the lower side ofthe carrier film 120 before removing of the wafer 101 and the cohesivelayer 120 b may be hardened. Then, the cohesive layer 120 b is hardenedand the wafer 101 may be easily removed. In the subsequent process, theplurality of semiconductor light-emitting devices 110 formed on thewafer 101 are each separated by dicing and the separate light emittingdevices 110 are packaged, thereby manufacturing a white light-emittingdevice package. At this point, the characteristics of white lightemitted through the phosphor layer 150 are examined and then thesemiconductor light-emitting devices 110 having desired emissioncharacteristics may be packaged. Then, white light-emitting devicepackages having uniform emission characteristics may be provided.

The form of the printing region 142 illustrated in FIG. 5 may vary. Forexample, in FIG. 6, the second masking member 145 and the third maskingmembers 146 are not separated from each other and only one secondmasking member 145 is formed in the printing region 142. In FIG. 5, thesecond masking member 145 that corresponds to the scribe line 114 formedbetween the semiconductor light-emitting devices 110 is separated fromthe third masking members 146 that correspond to the electrode pads 112and 113 formed on the semiconductor light-emitting devices 110. However,in FIG. 6, the second masking member 145 is extended to regionscorresponding to the electrode pads 112 and 113 of the semiconductorlight-emitting devices 110 through edge portions of the openings 144. Inthis case, the electrode pads 112 and 113 of the semiconductorlight-emitting devices 110 are easily covered and thus the phosphorpaste 160 may be prevented from being coated partially on the electrodepads 112 and 113.

In FIG. 7, the third masking members 146 that correspond to theelectrode pads 112 and 113 are formed only, i.e., without the secondmasking member 145 that corresponds to the scribe line 114. Also, inFIG. 7, the plurality of openings 144 that correspond to thesemiconductor light-emitting devices 110 are not formed in the printingregion 142 and instead, the entire printing region 142 is formed as oneopening 144. In this case, the phosphor paste 160 may be coated in thescribe line 114 formed between the semiconductor light-emitting devices110. Then, the phosphor layer 150 may be formed not only on the uppersurfaces of the semiconductor light-emitting devices 110 but also sidesof the semiconductor light-emitting devices 110. When light is partiallyemitted through the sides of the semiconductor light-emitting devices110, the printing mask 140 illustrated in FIG. 7 is used to form thephosphor layer 150 at the sides of the semiconductor light-emittingdevices 110.

Also, in FIG. 8, masking members are not formed in the printing region142, and the entire printing region 142 is formed as one opening 144. Inthis case, it is not required to arrange the printing mask 140 to matchwith the pattern of the semiconductor light-emitting devices 110 whencoating of the phosphor paste 160. Also, in this case, the phosphorpaste 160 may be coated not only in the scribe line 114 formed betweenthe semiconductor light-emitting devices 110 but also on the uppersurfaces of the semiconductor light-emitting devices 110. Accordingly,the phosphor layer 150 may be formed at the sides and on the uppersurfaces of the semiconductor light-emitting devices 110. That is, sincethe phosphor layer 150 is formed on the electrode pads 112 and 113 ofthe semiconductor light-emitting devices 110, the phosphor layer 150formed on the electrode pads 112 and 113 may need to be removed aftercompleting forming of the phosphor layer 150. The phosphor layer 150 maybe removed by irradiating laser 200 on the locations of the electrodepads 112 and 113, as illustrated in FIG. 9. In this regard, the laser200, which emits light in a wavelength band absorbed by the binder resinused in the phosphor paste 160, may be used. For example, in a siliconresin binder that is widely used, CO₂ laser having a long wavelength,which may be well absorbed by the silicon resin, may be used. Asdescribed above, when laser light is irradiated on the electrode pads112 and 113, the phosphor layer 150 formed on the electrode pads 112 and113 is removed and thus the electrode pads 112 and 113 may be exposed tothe outside.

As described above, the phosphor layer 150 is firstly formed on thewafer 101, on which the semiconductor light-emitting devices 110 areformed, and then the semiconductor light-emitting devices 110 on thewafer 101 are each separated through dicing. However, the semiconductorlight-emitting devices 110 on the wafer 101 may be firstly diced beforeforming the phosphor layer 150. For example, the wafer 101 is thinnedand then the semiconductor light-emitting devices 110 on the wafer 101are each separated through dicing. Then, the semiconductorlight-emitting devices 110 are arranged on the carrier film 120illustrated in FIG. 4. Here, the emission characteristics of thesemiconductor light-emitting devices 110 are previously examined, andthe semiconductor light-emitting devices 110 are classified according tothe emission characteristics. Then, the semiconductor light-emittingdevices 110 having the same emission characteristic may be arranged onthe carrier film 120. Then, the carrier film 120, on which the separatedsemiconductor light-emitting devices 110 are arranged, is disposed onthe vacuum table 130 by using the method described with respect to FIG.3 and then the printing mask 140 is used to form the phosphor layer 150on the separated semiconductor light-emitting devices 110 by usingscreen printing. That is, processes are the same as those describedabove except that dicing is performed prior to forming of the phosphorlayer 150.

When forming of the phosphor layer 150 is completed, the cohesive layer120 b is hardened and then the semiconductor light-emitting devices 110may be separately removed from the carrier film 120. Also, the carrierfilm 120 is directly cut so as to separate each semiconductorlight-emitting device 110. Here, when the flexible base film 120 a isused, the base film 120 a is pulled and extended so that intervalsbetween the semiconductor light-emitting devices 110 may increase. Then,since the intervals between the semiconductor light-emitting devices 110may be sufficiently secured, the semiconductor light-emitting devices110 may be easily removed from the carrier film 120 or the carrier film120 may be easily cut. As such, when dicing is performed prior toforming of the phosphor layer 150, the phosphor layer 150 may beprevented from being damaged or contaminated due to minute particlesgenerated during dicing.

It should be understood that the exemplary embodiments described thereinshould be considered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments.

1. A method of manufacturing a light-emitting device, the methodcomprising: forming a plurality of light emitting devices on a wafer;thinning the wafer, on which the plurality of light-emitting devices areformed; disposing the thinned wafer on a carrier film; and forming aphosphor layer on an emission surface of the plurality of light-emittingdevices on the wafer.
 2. The method of claim 1, wherein the forming ofthe phosphor layer comprises: disposing the carrier film, on which thewafer is disposed, on a vacuum table; closely adhering and fixing thecarrier film on the vacuum table by vacuum suction pressure; coating aphosphor paste on the wafer; and forming the phosphor layer by hardeningthe phosphor paste.
 3. The method of claim 2, wherein the vacuum tablehas a stepped structure, in which a center portion thereof protrudes tobe higher than peripheral portions thereof.
 4. The method of claim 3,wherein a carrier frame is disposed along a circumference of the carrierfilm, and wherein a diameter of the protruding center portion of thevacuum table is smaller than an inner diameter of the carrier frame. 5.The method of claim 4, wherein the carrier frame formed along thecircumference of the carrier film is closely adhered and fixed to theperipheral portions of the vacuum table, and the wafer disposed on thecarrier film is closely adhered and fixed to the center portion of thevacuum table.
 6. The method of claim 4, wherein a height of the centerportion of the vacuum table is higher than a height of the carrierframe.
 7. The method of claim 2, wherein the coating of the phosphorpaste comprises: disposing a printing mask on the wafer; providing thephosphor paste on the printing mask; and pressurizing the phosphor pasteby using a squeeze and uniformly coating the phosphor paste on thewafer.
 8. The method of claim 7, wherein the printing mask comprises amask frame formed around the circumference of the printing mask tosupport the printing mask, a first masking member formed to cover aregion other than the wafer, and a printing region corresponding to thewafer.
 9. The method of claim 8, wherein the printing region comprises aplurality of openings having the same pattern as that of the pluralityof light-emitting devices formed on the wafer, a second masking memberformed to correspond to the scribe line formed between thelight-emitting devices, and third masking members formed to correspondto electrode pads formed on the light-emitting devices.
 10. The methodof claim 8, wherein the printing region comprises a plurality ofopenings having the same pattern as that of the plurality oflight-emitting devices formed on the wafer and a second masking memberformed to correspond to the scribe line formed between thelight-emitting devices, the second masking member being extended toregions corresponding to the electrode pads formed on the light-emittingdevices.
 11. The method of claim 8, wherein the printing regioncomprises one opening entirely formed in the printing region and thirdmasking members formed to correspond to electrode pads formed on thelight-emitting devices.
 12. The method of claim 1, further comprising:after the phosphor layer is formed, removing the wafer from the carrierfilm; and dicing the plurality of light-emitting devices formed on thewafer.
 13. The method of claim 12, wherein the carrier film comprises abase film and a cohesive layer formed on the base film.
 14. The methodof claim 13, wherein the cohesive layer comprises a photosensitiveadhesive (PSA) that may be hardened by UV light and the base film haspermeability for UV light.
 15. The method of claim 14, wherein theremoving of the wafer from the carrier film comprises hardening thecohesive layer by irradiating UV light from the lower side of thecarrier film and removing the wafer from the hardened cohesive layer.16. A method of manufacturing a light-emitting device, the methodcomprising: forming a plurality of light-emitting devices on a wafer;thinning the wafer, on which the plurality of light-emitting devices areformed; separating the plurality of light-emitting devices formed on thewafer through dicing; arranging the separated light-emitting devices ona carrier film; and forming a phosphor layer on an emission surface ofthe plurality of light-emitting devices arranged on the carrier film.17. The method of claim 16, wherein the forming of the phosphor layercomprises: disposing the carrier film, on which the light-emittingdevices are arranged, on a vacuum table; closely adhering and fixing thecarrier film on the vacuum table by vacuum suction pressure; coating aphosphor paste on the light-emitting devices; and forming the phosphorlayer by hardening the phosphor paste.
 18. An apparatus formanufacturing a light-emitting device, the apparatus comprising: avacuum table comprising a center portion protruding upward andperipheral portions that are stepped to be lower than the centerportion; a carrier film disposed on the vacuum table for attaching thewafer, on which a plurality of light-emitting devices are formed, on thecarrier film; and a printing mask for uniformly coating a phosphor pasteon the wafer.
 19. The apparatus of claim 18, wherein the carrier filmcomprises a carrier frame formed along a circumference of the carrierfilm and a diameter of the protruding center portion of the vacuum tableis smaller than an inner diameter of the carrier frame.
 20. Theapparatus of claim 19, wherein when applying a vacuum to the vacuumtable, the carrier frame formed along the circumference of the carrierfilm is closely adhered and fixed to the peripheral portions of thevacuum table by vacuum suction pressure, and the wafer disposed on thecarrier film is closely adhered and fixed to the center portion of thevacuum table.
 21. The apparatus of claim 19, wherein a height of thecenter portion of the vacuum table is higher than a height of thecarrier frame.
 22. The apparatus of claim 18, wherein the printing maskcomprises a mask frame formed around the circumference of the printingmask to support the printing mask, a first masking member formed tocover a region other than the wafer, and a printing region correspondingto the wafer.
 23. The apparatus of claim 22, wherein the printing regioncomprises a plurality of openings having the same pattern as that of theplurality of light-emitting devices formed on the wafer, a secondmasking member formed to correspond to the scribe line formed betweenthe light-emitting devices, and third masking members formed tocorrespond to electrode pads formed on the light-emitting devices. 24.The apparatus of claim 22, wherein the printing region comprises aplurality of openings having the same pattern as that of the pluralityof light-emitting devices formed on the wafer and a second maskingmember formed to correspond to the scribe line formed between thelight-emitting devices, the second masking member being extended toregions corresponding to the electrode pads formed on the light-emittingdevices.
 25. The apparatus of claim 22, wherein the printing regioncomprises one opening entirely formed in the printing region and thirdmasking members formed to correspond to electrode pads formed on thelight-emitting devices.
 26. The apparatus of claim 18, wherein thecarrier film comprises a base film and a cohesive layer formed on thebase film.
 27. The apparatus of claim 25, wherein the cohesive layercomprises a photosensitive adhesive (PSA) that may be hardened by UVlight and the base film has permeability for UV light.